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Bambu Lab R1 鐳射激光切割機

HK$19,599.00

結賬時計算運費

Style

R1 R1 Long Material Bundle R1 Long Material & Rotary Bundle

數量

Product Features

55W CO2 Laser: Cut and engrave wood, clear acrylic, leather, and more, with materials up to 20 mm thick in a single pass.
Large Work Area: 600 × 300 mm, or up to 3000 mm long stock with the Conveyor.
Auto Laser Alignment: Hands-free optical path calibration in about a minute. No thermal paper, no test shots.
TriSense System: Cameras, lasers and XY encoders combined for positioning accuracy within 0.2 mm.
Vibration Compensation: Cancels residual shake after a turn for clean, crisp lines.
High-Speed Engraving: Up to 1000 mm/s with 20,000 mm/s² acceleration.
Class 1 Laser Safety: Fully enclosed beam in normal use, with lid-stop, flame detection and emergency stop.

Bambu Lab R1 鐳射激光切割機

Bambu Lab R1 鐳射激光切割機

Bambu Lab R1 鐳射激光切割機

Bambu Lab R1 鐳射激光切割機

Bambu Lab R1 鐳射激光切割機

Bambu Lab R1 鐳射激光切割機

Bambu Lab R1 鐳射激光切割機

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